CIO, PCWorld: Germany-based Fraunhofer Institute presents a 3.5mm-thin smartphone camera module that removes the need for a camera bump.
"It uses four image sensors rotated 90 degrees so they point out of the side of the phone. A set of tiny mirrors in front of the sensors reflects the image from the front or rear of the phone.
The basic concept would have worked with a single mirror, said Jacques Duparré, a senior scientist at Fraunhofer's Microoptical Imaging Systems lab in Jena, Germany.
But it faltered at close range, so a second mirror was added and the two images stitched together. But then stitching errors could be seen in the images, so engineers added a second set of sensors and mirrors so the phone could calculate and eliminate the errors.
The mirrors simply flip around so images can be taken to the front and rear of the phone."