Friday, August 29, 2008

Ziptronix Targets BSI Wafers Manufacturers

I-Micronews published an article about Ziptronix, a provider of wafer bonding solutions. Recently Ziptronix targets BSI sensors to use its patented room temperature direct oxide bonding process to attach a sensor wafer to a carrier wafer.

Thanks to J.B. for letting me know about the new Ziptronix offering.

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